Effect of polishing angle on material removal rate and surface finish using bonded abrasive pads

Obi, Stanley, Chen, Xun and Blunt, Liam (2009) Effect of polishing angle on material removal rate and surface finish using bonded abrasive pads. In: Lamdamap 9th International Conference, 30th June – 2nd July 2009, Brunel University. (Unpublished)

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URI:

https://eprints.hud.ac.uk/id/eprint/9803

Title:

Effect of polishing angle on material removal rate and surface finish using bonded abrasive pads

Creators:

Obi, Stanley, Chen, Xun and Blunt, Liam

Official URL:

http://www.lamdamap.com/content/News-and-events/eu...

Date:

June 2009

Subjects:

T Technology > T Technology (General)
T Technology > TJ Mechanical engineering and machinery

Schools:

School of Computing and Engineering
School of Computing and Engineering > Centre for Precision Technologies
School of Computing and Engineering > Centre for Precision Technologies > Advanced Machining Technology Group
School of Computing and Engineering > Diagnostic Engineering Research Centre
School of Computing and Engineering > Diagnostic Engineering Research Centre > Measurement System and Signal Processing Research Group
School of Computing and Engineering > High-Performance Intelligent Computing
School of Computing and Engineering > High-Performance Intelligent Computing > Information and Systems Engineering Group

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Item Type:

Conference or Workshop Item

Presentation Type:

Paper

Depositing User:

Sharon Beastall

Date Deposited:

11 Mar 2011 08:45

Revision:

9

Last Modified:

28 Aug 2021 11:04

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