This article presents a fixed-mesh total concentration method for modeling of deposition processes. It is adapted from the total concentration method initially proposed for etching process. The total concentration is defined as the sum of the concentration of the to-be-deposited (particles) and deposited materials (deposit). With this definition, the conservation equation for the total concentration, containing the interfacial conditions, can be derived and solved on a fixed mesh. The moving depositing front is captured implicitly by the concentration of the deposited material. The proposed method is validated against known exact solutions for a few one-dimensional deposition problems and solution from the level-set method for a two-dimensional problem. The method is used to investigate two-dimensional deposition without and with fluid flow coupled.