Parametric Numerical Study of the Flow and Heat Transfer in Microchannel with Dimples

Xu, M., Lu, H., Gong, L., Chai, John and Duan, X. (2016) Parametric Numerical Study of the Flow and Heat Transfer in Microchannel with Dimples. International Communications in Heat and Mass Transfer, 76. pp. 348-357. ISSN 0735-1933

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Abstract

The characteristics of flow and heat transfer in microchannel with dimples were numerically investigated. The geometric parameters of dimpled channel, including aspect ratio, dimple depth and dimple spacing, were independently studied under constant Reynolds number 500. A constant heat flux 1W/mm2 was adopted in the central area at the bottom of the microchannel heat sink to simulate a high power device. In comparison to straight channels, dimpled surface reduced the local flow resistance and also improved thermal performance of micro‐channel heat sink. Compared to flat channel case, the optimal dimpled case have 3.2K decrease of temperature, 15% gain of Nusselt number and 2% reduce of pressure drop.

Item Type:	Article
Subjects:	T Technology > TJ Mechanical engineering and machinery
Schools:	School of Computing and Engineering School of Computing and Engineering > Diagnostic Engineering Research Centre > Energy, Emissions and the Environment Research Group
Related URLs:	Author Publisher
Depositing User:	John Chai
Date Deposited:	09 Jun 2016 09:32
Last Modified:	28 Aug 2021 17:05
URI:	http://eprints.hud.ac.uk/id/eprint/28510

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