Multi-Pass Nanometric Machining Simulation using the Molecular Dynamics (MD)

Oluwajobi, Akinjide O. and Chen, Xun (2012) Multi-Pass Nanometric Machining Simulation using the Molecular Dynamics (MD). Key Engineering Materials, 496. pp. 241-246. ISSN 1013-9826

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Abstract

The multi-pass nanometric machining of copper with diamond tool was carried out using the Molecular Dynamics (MD) simulation. The copper-copper interactions were modelled by the EAM potential and the copper-diamond interactions were modelled by the Morse potential. The diamond tool was modelled as a deformable body and the Tersoff potential was applied for the carbon-carbon interactions. It was observed that the average tangential and the normal components of the cutting forces reduced in the consecutive cutting passes. Also, the lateral force components are affected by atomic vibrations and the cross sectional area during the cutting process.

Item Type:	Article
Subjects:	T Technology > TJ Mechanical engineering and machinery
Schools:	School of Computing and Engineering School of Computing and Engineering > Centre for Precision Technologies > Advanced Machining Technology Group
Related URLs:	Author
Depositing User:	Jide Oluwajobi
Date Deposited:	15 May 2012 13:35
Last Modified:	28 Aug 2021 11:16
URI:	https://eprints.hud.ac.uk/id/eprint/13407

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