Khoong, L.E., Lam, Y.C., Chai, John, Jiang, L. and Ma, J. (2007) Numerical and experimental investigations on thermal debinding of polymeric binder of powder injection molding compact. Chemical Engineering Science, 62 (23). pp. 6927-6938. ISSN 0009-2509Metadata only available from this repository.
A mathematical model is established to describe the thermal debinding process of polymeric binder from a powder injection molding compact. The model takes into account of the thermal degradation of liquid polymer into liquid volatile fragment, the evaporation of liquid volatile fragment, the capillary driven liquid phase transport, the binary diffusion in solution, the convection and diffusion of gas phases, and the heat transfer in a porous medium. The proposed model is solved numerically based on a finite volume method and validated with experimental data. Based on the numerical results, the binder removal, the pressure buildup, the binder distribution, the mass transfers, and the removal mechanisms during thermal debinding are studied.
|Subjects:||T Technology > TJ Mechanical engineering and machinery|
|Schools:||School of Computing and Engineering|
|Depositing User:||John Chai|
|Date Deposited:||28 Apr 2015 13:52|
|Last Modified:||28 Apr 2015 13:52|
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