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Effect of polishing angle on material removal rate and surface finish using bonded abrasive pads

Obi, Stanley, Chen, Xun and Blunt, Liam (2009) Effect of polishing angle on material removal rate and surface finish using bonded abrasive pads. In: Lamdamap 9th International Conference, 30th June – 2nd July 2009, Brunel University. (Unpublished)

Metadata only available from this repository.
Item Type: Conference or Workshop Item (Paper)
Subjects: T Technology > T Technology (General)
T Technology > TJ Mechanical engineering and machinery
Schools: School of Computing and Engineering
School of Computing and Engineering > Centre for Precision Technologies
School of Computing and Engineering > Centre for Precision Technologies > Advanced Machining Technology Group
School of Computing and Engineering > Diagnostic Engineering Research Centre
School of Computing and Engineering > Diagnostic Engineering Research Centre > Measurement System and Signal Processing Research Group
School of Computing and Engineering > High-Performance Intelligent Computing
School of Computing and Engineering > High-Performance Intelligent Computing > Information and Systems Engineering Group
Related URLs:
Depositing User: Sharon Beastall
Date Deposited: 11 Mar 2011 08:45
Last Modified: 11 Mar 2011 08:45
URI: http://eprints.hud.ac.uk/id/eprint/9803

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