Effect of polishing angle on material removal rate and surface finish using bonded abrasive pads

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Obi, Stanley, Chen, Xun and Blunt, Liam (2009) Effect of polishing angle on material removal rate and surface finish using bonded abrasive pads. In: Lamdamap 9th International Conference, 30th June – 2nd July 2009, Brunel University. (Unpublished)

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Official URL: http://www.lamdamap.com/content/News-and-events/eu...

Item Type:	Conference or Workshop Item (Paper)
Subjects:	T Technology > T Technology (General) T Technology > TJ Mechanical engineering and machinery
Schools:	School of Computing and Engineering School of Computing and Engineering > Centre for Precision Technologies School of Computing and Engineering > Centre for Precision Technologies > Advanced Machining Technology Group School of Computing and Engineering > Diagnostic Engineering Research Centre School of Computing and Engineering > Diagnostic Engineering Research Centre > Measurement System and Signal Processing Research Group School of Computing and Engineering > Informatics Research Group School of Computing and Engineering > Informatics Research Group > XML, Database and Information Retrieval Research Group
Related URLs:	Author Author
Depositing User:	Sharon Beastall
Date Deposited:	11 Mar 2011 08:45
Last Modified:	11 Mar 2011 08:45
URI:	http://eprints.hud.ac.uk/id/eprint/9803

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