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Platts, A. and Taylor, D. (2002) Rapid inductive fault analysis for high-yield circuits. Microelectronics Journal, 33 (3). pp. 279-284. ISSN 0026-2692
Metadata only available from this repository.Official URL: http://dx.doi.org/10.1016/S0026-2692(01)00138-0
Abstract
Inductive fault analysis (IFA) is a powerful tool for estimating yield loss due to faults caused by particulate contamination during processing. The major disadvantage of IFA is that it is essentially an empirical technique and involves the simulation of millions of identical die in order to arrive at meaningful results. This paper demonstrates that the analysis of high-yield circuits can be speeded up considerably by simulating fewer circuits, but using appropriately scaled defect densities
| Item Type: | Article |
|---|---|
| Subjects: | T Technology > T Technology (General) T Technology > TK Electrical engineering. Electronics Nuclear engineering |
| Schools: | School of Computing and Engineering School of Computing and Engineering > Computer Graphics, Imaging and Vision Research Group |
| Depositing User: | Briony Heyhoe |
| Date Deposited: | 01 Oct 2008 10:13 |
| Last Modified: | 06 Jan 2011 09:29 |
| URI: | http://eprints.hud.ac.uk/id/eprint/2050 |
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