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Simulation Study of Cutting Forces, Stresses and Temperature during Nanometric Cutting of Single Crystal Silicon

Goel, Saurav, Luo, Xichun, Reuben, R.L., Bin Rashid, Waleed and Sun, Ji Ning (2011) Simulation Study of Cutting Forces, Stresses and Temperature during Nanometric Cutting of Single Crystal Silicon. Key Engineering Materials, 496. pp. 223-228. ISSN 1662-9795

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Abstract

Wear of diamond tool has always been a limiting factor in ductile regime machining of large size silicon components. In order to understand the tool wear phenomena, it is non-trivial to know the process outputs especially cutting forces, stresses and temperature during nanometric turning. In this paper, a realistic potential energy function has been deployed through molecular dynamic (MD) simulation, to simulate the process outputs of single diamond turning operation against single crystal silicon. The simulation result suggests that wear mechanism of diamond tool is fundamentally governed by these process parameters and thus critical.

Item Type: Article
Subjects: T Technology > T Technology (General)
T Technology > TJ Mechanical engineering and machinery
Schools: School of Computing and Engineering
School of Computing and Engineering > Centre for Precision Technologies
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Depositing User: Sara Taylor
Date Deposited: 13 Dec 2012 15:10
Last Modified: 13 Dec 2012 15:10
URI: http://eprints.hud.ac.uk/id/eprint/16347

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